Plasma processing

Results: 359



#Item
201Sustainability / Plasma physics / Plasma processing / Waste management / Plasma arc waste disposal / Plasma / Waste-to-energy / Waste Management /  Inc / Incineration / Technology / Environment / Thermal treatment

PyroGenesis Canada Inc. (TSXV: PYR) October 6, 2014 Highlights Cutting-edge technology: PyroGenesis is one of the largest plasma companies in the world, servicing

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Source URL: www.pyrogenesis.com

Language: English - Date: 2014-10-07 09:07:17
202Sustainability / Thermal treatment / Waste / Plasma physics / Plasma processing / Gasification / Municipal solid waste / Landfill / Plasma / Environment / Waste management / Technology

Microsoft Word - eNews_Man_010311.doc

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Source URL: www.dsiac.org

Language: English - Date: 2011-01-04 10:32:58
203Technology / Etching / Plasma processing / Microelectromechanical systems / Transducers / Dry etching / Isotropic etching / Plasma etching / Wafer / Semiconductor device fabrication / Microtechnology / Materials science

News Release Nanoplas Announces Important New 14nm Order and Joint Development Agreement with CEA-Leti High-selectivity dry-etch for 14nm OEM pilot line will replace wet etch; CEA-Leti to qualify the system for addition

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Source URL: www-leti.cea.fr

Language: English - Date: 2013-11-27 09:43:38
204Plasma processing / Technology / Physics / Etching / Plasma / CL2 / Semiconductor device fabrication / Materials science / Microtechnology

SiCl4/Cl2 plasmas: a new chemistry to etch high-k material selectively to Si-based alloys P. Bodarta, G. Cungea, C. Petit-Etiennea, M. Darnona, M. Haassa, S. Bannab, O.Jouberta and T.Lillb a CNRS-LTM,

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Source URL: www-leti.cea.fr

Language: English - Date: 2012-05-24 09:08:30
205Plasma processing / Technology / Physics / Membrane technology / Hydrogen technologies / Chemical vapor deposition / Plasma-enhanced chemical vapor deposition / Nanoparticle / Membrane electrode assembly / Chemistry / Thin film deposition / Semiconductor device fabrication

FCH Review day[removed]smallinone[removed]Mode de compatibilité]

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Source URL: www.fch-ju.eu

Language: English - Date: 2014-09-28 16:54:22
206Plasma processing / Technology / Physics / Etching / Plasma / CL2 / Semiconductor device fabrication / Materials science / Microtechnology

SiCl4/Cl2 plasmas: a new chemistry to etch high-k material selectively to Si-based alloys P. Bodarta, G. Cungea, C. Petit-Etiennea, M. Darnona, M. Haassa, S. Bannab, O.Jouberta and T.Lillb a CNRS-LTM,

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Source URL: www-leti.cea.fr

Language: English - Date: 2012-05-24 09:08:30
207Technology / Etching / Plasma processing / Microelectromechanical systems / Transducers / Dry etching / Isotropic etching / Plasma etching / Wafer / Semiconductor device fabrication / Microtechnology / Materials science

News Release Nanoplas Announces Important New 14nm Order and Joint Development Agreement with CEA-Leti High-selectivity dry-etch for 14nm OEM pilot line will replace wet etch; CEA-Leti to qualify the system for addition

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Source URL: www-leti.cea.fr

Language: English - Date: 2013-11-27 09:43:38
208Coatings / Thin films / Plasma processing / Thin film / Chemical vapor deposition / Corrosion / Nafion / Electrochemistry / Atomic layer deposition / Chemistry / Thin film deposition / Semiconductor device fabrication

T ECH HIGHLIGH T S Improved Understanding of Parameters Contributing to Corrosion Resistance of Sputtered Al Thin Films Evaporated and sputter-deposited thin

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Source URL: www.electrochem.org

Language: English - Date: 2014-08-26 16:39:54
209Microtechnology / Plasma processing / Etching / Plasma / Microfabrication / Wafer / Isotropic etching / Thin film / Integrated circuit / Semiconductor device fabrication / Materials science / Technology

Computer Chips new:Environment[removed]

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Source URL: www.plasmacoalition.org

Language: English - Date: 2006-08-29 00:35:20
210Plasma physics / Titanium / Adhesive / Laser / Ablation / Adhesion / Coating / Chemistry / Physics / Materials science

Novel Bonding Methodologies Toward the Attainment of Primary Bonded Aircraft Structure Project WBS Number: [removed][removed]PI: Dr. John W. Connell, Advanced Materials and Processing Branch, NASA LaRC
Co-I: Dr.

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Source URL: nari.arc.nasa.gov

Language: English - Date: 2014-10-17 18:20:41
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